Important Dates

Abstract submission

Closed

Notification of full paper acceptance

14 April 2025 Extended to 18 Apr 2025

Submission of Camera Ready

24 April 2025 Extended to 28 Apr 2025

Submission of Camera Ready

24 April 2025 Extended to 28 Apr 2025
Registration

About DoCEIS 2025

Cyber-Physical Systems (CPS) form the backbone of today’s interconnected world, seamlessly blending physical processes with computational intelligence. The integration of Artificial Intelligence (AI) into CPS significantly enhances their capabilities—enabling real-time adaptability, autonomous decision-making, and intelligent responses to complex environments. AI-driven CPS are revolutionizing industries and redefining how technology interacts with the physical world to tackle critical global challenges. The 2025 edition of DoCEIS invites doctoral students to present their cutting-edge research in this transformative area. Join us in this interdisciplinary forum to showcase your contributions, engage in meaningful dialogue, and help shape the future of AI-powered cyber-physical innovation.

DoCEIS 2025 Sponsors

Organisational Sponsors

Technical Sponsors

Commerical Sponsors

Proceedings

Proceedings published by Springer, IFIP AICT series (indexed in Web of Science, SCOPUS and DBLP). Best papers will be considered for possible inclusion in a special journal issue. The Proceedings will be published by Springer and will be available soon .

Associated Event

YEF-ECE 2025 (July 4, 2025)

The International Young Engineers Forum is dedicated to exploring the latest developments and innovative applications in the fields of electrical and computer engineering. This prestigious event focuses on the design and utilization of systems, aiming to create efficient devices and systems complemented by appropriate control algorithms. These advancements are essential to meet the diverse needs of business and industry in our increasingly global economy. This unique event offers a remarkable opportunity for young engineers around the globe. It's not just a platform to delve into the cutting-edge of engineering technology, but also a place for participants to connect with one another. The forum facilitates the sharing of experiences and ideas, fostering a collaborative environment that is essential for professional growth and global activity